Brands - Vishay Electro-Films
Engineering Tools

Vishay EFI offers many different engineering tools to help guide engineers when designing a new custom part or choosing an existing commercial part that will work in their application.

Design Guidelines

Title Description
Vishay Electro-Films Design Guideline This multi-sectioned document provides a roadmap to integrate thin film technologies for the design process starting with substrate material selection and ending with finished product singulation.
Wirebondable Passive Components Guide to Vishay EFI’s most popular wire bondable chip components
High Frequency Products Brochure highlighting Vishay Dale’s qualified RF and High Frequency products
S-Parameters S-Parameters for P/N’s CH, FC, MIC, RCP, RFLW3N and RFLW5N
AuSn Design Guideline Benefits and design instructions of Vishay EFI’s sputtered 80/20 eutectic AuSn
Design of Plated and Filled Via Circuits Technical Note of the applications and design of Vishay EFI’s plated and Au filled via circuits
RF Filters and Custom RF Design Guideline Guide to utilizing Vishay EFI’s build to print services when designing products for RF applications
Vishay EFI Diced on Tape Guidelines Guide for Vishay EFI part numbers with the pack code “ST” which are sold as a full 3" or 5" wafers that have been diced into individual die.
Waffle Pack Information Table detailing the number of pockets in the waffle packaging for each part family
Tape and Reel Tape and Reel specifications for Vishay Dale Thin Film
PIMIC Introduction Technical Note of substrate passive integrated microelectronic interconnect circuitry technology
Medical 101 Brochure highlighting Vishay Dale’s parts that benefit and supply the Medical Industry
Resistors 101 Brochure highlighting Vishay Dale’s resistors options
LED Submount Design Guideline Guide to designing LED submounts for LED applications with high current and heat challenges
Ceramic Thin Film LED Guide to designing LED packages