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For more information:
Media contact -  Andrew Post, Sr. Manager, Global Communications
Phone:  1.610.251.5287 
Fax:  1.610.889.9429 
E-mail:  andrew.post@vishay.com

New Vishay Siliconix Devices Save Space

New Vishay Siliconix Devices Occupy Half the Footprint of Standard TSOP-6 - Save Space in Cell Phones and Notebook Computers


 
For more information:
Media contact -  Andrew Post, Sr. Manager, Global Communications
Phone:  1.610.251.5287 
Fax:  1.610.889.9429 
E-mail:  andrew.post@vishay.com

MALVERN, PENNSYLVANIA - September 22, 1999 - In a move that will dramatically reduce the board space required for power circuitry in mobile communications and computing products, Vishay Intertechnology today announced that it is sampling the industry's first power MOSFETs in a leadless, 1206 surface-mount package with a total footprint of 3.05 mm by 1.80 mm.

The new Vishay Siliconix ChipFETTM power MOSFETs occupy approximately half the board area required by a leaded TSOP-6, allowing designers to shrink the power management circuitry for cell phones and notebook computers into about half the space previously needed.

Performance improvements with the new ChipFETs will be significant as well. Compared to TSOP-6 power MOSFETs, on-resistance in the new 1206 ChipFETs has been reduced by as much as 35% and power dissipation has been increased by as much as 25%. On-resistance for the single n-channel Si5404DC, for example, is just 30 milliohms max, with power dissipation of 2.5 W.

With an initial product offering of 10 devices in the 8-pin 1206 package, the new ChipFETs are available in 8-V, 20-V, and 30-V versions with operating voltages as low as 1.8 V. Both single and dual devices, including a dual n- and p-channel MOSFET in the same package, are available.

"As power MOSFET packages have become smaller and smaller, the proportion of the footprint area occupied by the leads has become increasingly significant," said Hamza Yilmaz, Senior Vice President of Vishay Siliconix. "In the case of the TSOP-6, for example, the leads account for almost half the total footprint. With the new ChipFET devices, this wasted PC board space can now be eliminated altogether or used to add new features or capabilities within a smaller area."

Typical applications for the new ChipFETs will include load switching, low-power dc-to-dc conversion, battery switching, and lithium ion battery protection circuits. A summary of specifications for the first ChipFET devices in the 1206 package follows.

Samples of all 10 new devices are available now. Production quantities are available with lead times of 8 to 10 weeks for larger orders.

Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can be found on the Internet at www.vishay.com.

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ChipFET is a trademark of Vishay Siliconix.

For more information:
Media contact -  Andrew Post, Sr. Manager, Global Communications
Phone:  1.610.251.5287 
Fax:  1.610.889.9429 
E-mail:  andrew.post@vishay.com