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Siliconix Unveils PowerPAK™ Power MOSFET Roadmap: New Package Technology is Breakthrough for High Power Density Applications
SO-8- and 1212-Sized Devices Targeted at High-Performance Notebook and Desktop Computers, Communications Networks
SANTA CLARA, CALIFORNIA -- November 28, 2000 - Siliconix incorporated (NASDAQ NMS: SILI), an 80.4%-owned subsidiary of Vishay Intertechnology, Inc. (NYSE: VSH), has unveiled its roadmap for an advanced power MOSFET packaging technology that will provide dramatic space savings and greatly improved thermal performance for power conversion and power management circuitry in computers, communications networks, and handheld information appliances.
Dubbed PowerPAK™, and introduced at electronica 2000 in Munich, Germany, the new packaging technology will enable devices with thermal resistance of 1°C/W, or approximately the same as a twice-as-large, twice-as-thick DPAK power MOSFET. By comparison, thermal resistance is 16°C/W for a single-channel, standard SO-8.
PowerPAK devices achieve this superior thermal performance by providing a direct thermal path from the backside of the copper die attach pad to the printed circuit board. Unlike power MOSFET packages with an exposed die, PowerPAK's design provides a consistent footprint regardless of the particular silicon used in a given device, eliminating the need for retooling to accommodate devices with different on-resistance ratings.
In addition to their enhanced thermal performance, on-resistance for the new PowerPAK devices will be extraordinarily low for their package size -- comparable to best-in-class DPAK power MOSFETs, since the new SO-8 PowerPAK offers the same cavity size, and can thus use the same die, as devices packaged in the DPAK package. at http://www.vishay.com.
Increases in processor frequencies are driving up power demands in notebook and desktop computers and handheld information appliances, while the market continues to put a premium on end products that are as thin and lightweight as possible. In portable wireless communications devices, keeping heat to a minimum is essential. PowerPAK addresses these challenges by handling higher current densities without increasing the board space occupied by power semiconductors and without generating additional heat. For this reason, PowerPAK will be key to enabling end products that use the most advanced processor technologies while also supporting the market's demand for greater portability.
Siliconix is introducing PowerPAK power MOSFETs with devices in the SO-8 size and also in a 1212-outline, 8-pin package that will offer on-resistance performance comparable to many devices in the TSSOP-8 but with a 48% smaller footprint, an 11% thinner height profile, and dramatically lower thermal resistance of <2°C/W. Thermal resistance is 34°C/W for the standard TSSOP-8 package.
Beginning next month, Siliconix will begin releasing PowerPAK devices in families optimized for load switching, core voltage dc-to-dc conversion, and fixed telecom dc-to-dc conversion, lithium ion battery management, with breakdown voltage ratings ranging from 20 V to 150 V. In addition to single- and dual-channel power MOSFETs, Siliconix will be offering PowerPAK combination MOSFET and Schottky diode devices, aimed at battery switching applications, which will significantly benefit from PowerPAK's heat dissipation capabilities.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers
of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors,
and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial,
computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product
innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can
be found on the Internet at www.vishay.com.