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Media contact - Bob Decker, Red Pines Group
Vishay's Thin-Film, Single- and Multilayer High-Density Interconnects Integrate Conductor Patterns and Other Passive Components in Custom Resistor Solutions
MALVERN, PENNSYLVANIA - January 10, 2003 - Vishay Intertechnology, Inc. (NYSE: VSH) today announced the release of new thin-film, single- and multilayer high-density interconnects (HDIs), low-noise products with enhanced signal routing and response conditioning that integrate conductor patterns and other passive components in custom resistor solutions.
Each of these patterned, thin-film substrates is designed by Vishay Electro-Films (EFI) with the customer, the two working as a team to develop application-specific solutions for use in microwave circuitry and hybrid circuitry in high-performance, low-noise power amplifiers; avionics; satellites; and medical instrumentation. Because of the high complexity of these devices and their close relationship to end-product performance, this team-oriented approach ensures the optimum ratio of price to performance.
Vishay EFI has had distinctive success in developing and manufacturing rugged and well-defined air bridges down to a 0.001-in. width with consistent air-gap dimensions. Because multilayer HDIs are built up rather than out, they are capable of integrating a greater number of components into a much smaller footprint. Dimensions for each device may be as small as 0.02 in. by 0.02 in. or as large as 4 in. by 4 in., with thickness ranging from 0.005 in. to 0.050 in.
The new HDIs may be manufactured in designs of up to five layers and with special shapes, vias, and patterns. Each is available with a nichrome or tantalum nitride resistor element and in a wide variety of materials and conductor and adhesion metals. Additional options include metallized through holes, backside metallizing and patterning, wrap-around patterned edges, thick copper power line conductors, filled vias for added low-thermal-conductivity paths to a ground plate heat sink, and both aluminum and gold wire bond pads on the same substrate to provide monometallic interfaces in very-high-temperature applications. Multi-level metallization is achieved using polyimide insulation. Available substrates are alumina (Al2O3), beryllium oxide (BeO), aluminum nitride (AlN), quartz, and silicon.
Vishay EFI design guidelines provide the parameters required for successful design and manufacture of each substrate.
HDI Single Layer data sheet
HDI Multi Layer data sheet
Readers may obtain a price quotation by e-mailing drawings or requirements to email@example.com.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers
of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors,
and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial,
computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product
innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can
be found on the Internet at www.vishay.com.