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For more information:
Media contact -  Bob Decker, Redpines
Phone:  1.415.409.0233 
Fax:  1.650.618.1512 
E-mail:  bob.decker@redpinesgroup.com

Sales contact: 

Vishay's New SMF (DO219-AB) Diode Package Combines High Power Capability, 0.98-mm Height Profile for Substantial PCB Space Savings

New Package Platform for Switching, Schottky, ESD Protection, and Zener Diodes Offers Exceptional Reliability, Performance for a Wide Range of Compact Systems


Diode
For more information:
Media contact -  Bob Decker, Redpines
Phone:  1.415.409.0233 
Fax:  1.650.618.1512 
E-mail:  bob.decker@redpinesgroup.com

Sales contact: 

MALVERN, PENNSYLVANIA — October 10, 2003 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced the availability of more than 120 diode devices in the SMF (DO219-AB) package, which combines high power capability and miniaturized dimensions of 3.7 mm by 1.8 mm by 0.98 mm to allow considerable space savings on printed circuit boards.

With its industry-low package height of 0.98 mm - as much as 50% lower than competing devices - the SMF (DO219-AB) package reduces space requirements and improves circuit board density. Vishay Semiconductors diode products offered in the SMF address all industry segments and include switching, fast switching, ultrafast switching, Schottky, ESD protection, and Zener diodes.

The SMF (DO219-AB) package meets the demand for smaller and thinner diodes that enable small and light portable products, such as cellular phones, notebook PCs, and portable consumer products, as well as space-constrained automotive modules.

By maximizing power dissipation per unit of board space used, the package also serves in portable and wireless board designs that must meet strict power-management and protection requirements.

Designers will use the SMF-packaged devices as drop-in replacements for the diodes in the SOD-123FL, SOD-87, and PowerMite, compared to which the SMF offers better power handling and up to a 50% lower height profile. The SMF (DO219-AB) package can also be used to replace larger-footprint devices such as the SMA and M1F with space savings up to 40%.

High power capability and low forward voltage are delivered by Vishay's patented folded lead frame technology, which ensures optimum power efficiency, as well as superior surge-current capability compared to wire bond packages for excellent effectiveness in protection applications. Vishay's low-leakage-current silicon technology has been designed into the new packaging to improve energy savings.

The SMF (DO219-AB) delivers this enhanced performance also in an environmentally friendly, lead (Pb)-free package platform. It is 260 C reflow capable to Moisture Sensitivity Level (MSL) 1, and it is backward compatible with existing reflow processes.

Samples and production quantities of SMF (DO219-AB) packaged diodes from Vishay Semiconductors are available now, with lead times of six to eight weeks for larger orders.

Data sheets are available for:

SL04 (Schottky)
BZD27Cx.xP (Zener & Protection)
GZFx.xC (Zener)
SMFx.xA (ESD Protection)
RS07x (Fast Switching
ES07x (Ultrafast Switching)

Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can be found on the Internet at www.vishay.com.

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For more information:
Media contact -  Bob Decker, Redpines
Phone:  1.415.409.0233 
Fax:  1.650.618.1512 
E-mail:  bob.decker@redpinesgroup.com

Sales contact: