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New Vishay Silconix N-Channel PowerPAK® ChipFET® MOSFETs Offer Same 3-W Maximum Power Dissipation as Larger SO-8 in 81 % Smaller Footprint
New Devices Feature Low On-Resistance Values Down to 0.015 Ω
MALVERN, Pa. — January 15, 2007 —Vishay Intertechnology, Inc. (NYSE: VSH) today released eight n-channel power MOSFETs in an innovative new PowerPAK® ChipFET® package that offers advanced thermal performance in a compact 3 mm by 1.8 mm footprint. Featuring a broad variety of configurations and voltages, the new devices allow designers to easily replace larger power MOSFETs in a wide range of power conversion applications.
As a space-saving alternative to MOSFETs in the much larger SO-8 package, the new PowerPAK ChipFET devices deliver higher power density by offering the same 3-W maximum power dissipation with an 81 % smaller footprint area, and a 48 % thinner height profile (0.8 mm).
For optimized design efficiency, n-channel power MOSFETs in Vishay’s new PowerPAK ChipFET family are designed for point-of-load, synchronous rectification, and logic-level dc-to-dc conversion applications in low-power computer and fixed telecomm applications where space is at a premium.
N-channel PowerPAK ChipFET devices will also be used as load switches in portable electronic systems and notebook PCs, delivering footprint savings of 33 %, a 23 % thinner height profile, and a 9 % reduction in on-resistance at a 4.5-V gate drive compared to power MOSFETs in the TSOP-6.
Among the eight new devices announced today are single, dual, and single-plus-Schottky-diode power MOSFETs, with breakdown voltage ratings from 20 V to 60 V.
Single n-channel power MOSFETs in the PowerPAK ChipFET family are rated for typical thermal resistance values as low as 3 °C/W (RthJC), with maximum on-resistance values as low as 0.015 Ω in a 20 VDS n-channel single-channel device, and 0.039 Ω in a dual-channel device. The single-plus-Schottky-diode power MOSFETs feature on-resistance values as low as 0.039 Ω and Schottky diode forward voltage of 0.375 V at 1 A.
All of these new PowerPAK ChipFET devices are pin-compatible with products in the standard ChipFET package.
Links to product datasheets:
Samples and production quantities of the new PowerPAK ChipFET devices are available now, with lead times of 12 to 14 weeks for larger orders.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers
of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors,
and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial,
computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product
innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can
be found on the Internet at www.vishay.com.
PowerPAK and ChipFET are registered trademarks of Siliconix incorporated.