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Vishay Intertechnology Releases Four 45 V TMBS® Trench MOS Barrier Schottky Rectifiers for Solar Bypass Applications in SMPC and Axial-Leaded Packages
MALVERN, Pa. — Jan. 20, 2011 — Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its TMBS® Trench MOS Barrier Schottky rectifiers for solar bypass applications with four new 45 V devices offering eSMP® surface-mount and axial-leaded package options.
The devices released today are designed to enable higher current densities in low-voltage, high-frequency inverters, and solar cell junction boxes, where they will be used as bypass diodes for photovoltaic solar cell protection.
Axial-leaded rectifiers released today include the 15 A VSB1545 and 20 A VSB2045 in the P600 package. The devices can handle solder dip temperatures to 275 °C for 10 seconds per JESD 22-B106, and feature a maximum junction temperature of + 150 °C
The TMBS rectifiers combine their high forward surge capability with low forward voltage drops down to 0.30 V to minimize power losses. The devices are compliant to RoHS Directive 2002/95/EC and WEEE 2002/96/EC, and are halogen-free according to the IEC 61249-2-21 definition.
Samples and production quantities of the new 45 V TMBS rectifiers are available now, with lead times of eight weeks for larger orders.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers
of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors,
and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial,
computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product
innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can
be found on the Internet at www.vishay.com.
eSMP is a registered trademark of Vishay Intertechnology.