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Vishay Intertechnology to Showcase Industry-Leading Wire-Bondable and Ceramic Vishay Electro-Films Products at IMS 2011
MALVERN, PENNSYLVANIA — May 31, 2011 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing the company’s latest industry-leading wire-bondable and ceramic Vishay Electro-Films products at the 2011 IEEE MTT-S International Microwave Symposium (IMS), being held June 5-10 at the Baltimore Convention Center in Baltimore, Maryland.
At booth 4509, Vishay will be highlighting its wire-bondable thin film resistors, capacitors, and inductors for RF module, hybrid, and chip-on-board applications. In addition, the company’s ceramic thin film interconnect substrates will be on display for amplifiers, power dividers, filters, and other RF components.
Part of International Microwave Week, IMS is the world’s premier microwave conference. It features a large trade show, technical sessions, workshops, and panel sessions covering a wide range of topics, including wireless communication, radar, RF technologies, microwave electronics and applications, and more.
For more information on IMS 2011, visit http://ims2011.org/.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers
of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors,
and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial,
computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product
innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can
be found on the Internet at www.vishay.com.