For more information:
Media contact - Andrew Post, Sr. Manager, Global Communications
Vishay Intertechnology to Showcase Latest Industry-Leading Power MOSFET, Passive Component, Diode, and IC Technologies at APEC® 2012
MALVERN, Pa. — Jan. 26, 2012 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology line-up for the Applied Power Electronics Conference and Exposition (APEC®) 2012, taking place Feb. 5-9 at the Disney Coronado Springs Resort in Orlando, Florida. In booth 911, the company will be highlighting its latest industry-leading power MOSFET, passive component, diode, and power IC technologies for a wide range of applications.
Vishay power MOSFET technologies on display at APEC 2012 will include the company’s E Series of MOSFETs, which features 30 % lower on-resistance than other 600 V to 650 V devices. In addition, TrenchFET® IV devices will be featured, which offer half the on-resistance of previous-generation devices. For automotive applications, visitors to Vishay’s booth will see how the SQJ858AEP MOSFET in the PowerPAK® SO-8 package offers half the size and similar performance to devices in the DPAK package.
Vishay power IC products to be highlighted are optimized for a wide range of applications and end products. For point-of-load applications, the company will feature high-efficiency synchronous buck regulators and microBUCK® regulators, while DrMOS power stages will be on display for notebooks, servers, desktops, and graphic cards. In addition, integrated and versatile primary side controllers for full-bridge intermediate bus applications will be featured.
Power diodes from Vishay will include ultra-low forward voltage drop TMBS® Trench MOS Barrier Schottky rectifiers for use in low-voltage, high-frequency DC/DC converters and polarity protection applications. For single- and three-phase solar inverters, the company will highlight solar modules in EmiPak2 packages featuring state-of-the-art 650 V high-speed MOSFETs, SiC Schottky diodes, FRED Pt® ultrafast diodes, and Trench IGBTs.
Passive components from Vishay will consist of a wide variety of the company’s latest capacitors, resistors, and inductors. Featured capacitors will include miniaturized aluminum DC-link devices for solar inverters and DC-link film devices for mid-power electronics; snubber metallized polypropylene pulse capacitors; high-voltage ceramic devices; wet tantalum high-energy capacitors; HVArc Guard® devices to prevent surface arc-over in high-voltage applications; and much more.
Highlights of Vishay’s line of resistors will include high-voltage devices, Power Metal Strip® resistors, wirewound resistors for pulsing applications, stainless steel crowbar devices, AEC-Q200-qualified thin film resistors, metal oxide high-surge varistors for transient and overvoltage protection applications, and mini lug temperature sensors for power electronics thermal management applications. Featured inductors will include wireless charging/receiving coils.
As The Premier Event in Applied Power Electronics™, APEC focuses on the practical and applied aspects of the power electronics business. For more information on the conference and exposition, visit http://www.apec-conf.org/.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers
of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors,
and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial,
computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product
innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can
be found on the Internet at www.vishay.com.
TrenchFET, PowerPAK, and microBUCK are registered trademarks of Siliconix incorporated. TMBS, FRED Pt, HVArc Guard, and Power Metal Strip are registered trademarks of Vishay Intertechnology.