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For more information:
Media contact -  Andrew Post, Sr. Manager, Global Communications
Phone:  1.610.251.5287 
Fax:  1.610.889.9429 
E-mail:  andrew.post@vishay.com

Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at 2014 OFC/NFOEC

Technology Line-Up to Include Custom Submounts and Substrates, RF Capacitors, and Wire-Bondable Products


Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at 2014 OFC/NFOEC
For more information:
Media contact -  Andrew Post, Sr. Manager, Global Communications
Phone:  1.610.251.5287 
Fax:  1.610.889.9429 
E-mail:  andrew.post@vishay.com

MALVERN, Pa. — Feb. 27, 2014 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2014 Optical Fiber Communications Conference and Exhibition/National Fiber Optic Engineers Conference (OFC/NFOEC), taking place from Mar. 9-13 at the Moscone Center in San Francisco. In booth 3482, products on display will include a wide range of Vishay EFI custom submounts, custom substrates with sidewall patterning, high-performance RF capacitors, and wire-bondable products.

Featured submounts at the 2014 OFC/NFOEC will include Vishay EFI's AlN (Aluminum Nitride), BeO (Beryllium Oxide), and Al203 (Aluminum Oxide) ceramic substrates, which offer copper-filled vias, thick copper traces, and laser-machined shapes. For bonding, gold/tin solder features 70/30 to 80/20 compositions and thickness from 2 m to 8 m. Also on display will be Vishay EFI's custom substrates with sidewall patterning. Ideal for high-frequency circuits in RF applications and high-bit-rate transceivers, the substrates feature a plate thickness ≤ 0.025 in, minimum gap of 0.003 in, and are available in a variety of metal systems.

For impedance matching circuits, decoupling, DC blocking, and lumped element filters, Vishay EFI will be highlighting its RFCS surface-mount thin film RF capacitors. The devices feature capacitance from 0.2 pF to 27 pF, low DCR, and high Q and SRF. Highlighted wire-bondable products will include resistors with TCR to 25 ppm/C and power ratings to 1 W; resistor networks with tolerances to 0.05 %; single and binary capacitors; and inductors with inductance from 3 nH to 150 nH.

The OFC/NFOEC is the largest global conference and exposition for optical communications and networking professionals. For more information on the event, visit http://www.ofcnfoec.org.

Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can be found on the Internet at www.vishay.com.

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For more information:
Media contact -  Andrew Post, Sr. Manager, Global Communications
Phone:  1.610.251.5287 
Fax:  1.610.889.9429 
E-mail:  andrew.post@vishay.com