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Vishay Intertechnology to Exhibit Leading High-Frequency, Precision, and Wire-Bondable MLCCs, Resistors, and Inductors at IMS2015
MALVERN, Pa. — May 14, 2015 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology lineup for the 2015 IEEE MTT International Microwave Symposium (IMS2015), being held from May 17-22 at the Phoenix Convention Center in Phoenix, Arizona. At the conference and exhibition, the company will be highlighting its latest industry-leading multilayer ceramic chip capacitors (MLCCs) and surface-mount and wire-bondable thin film products.
In booth 2929, Vishay Vitramon will showcase its line of QUAD high-frequency, high-power MLCCs in the 0505, 1111, 2525, and 3838 case sizes, which feature high Q > 2000, ultra-low ESR down to 0.01 Ω, and voltage ratings from 200 V to 7200 V. The devices are optimized for a wide range of high-frequency applications, including MRI coils and generators, RF instrumentation, and impedance matching networks.
In addition, Vishay Vitramon’s surface-mount, high-frequency MLCCs in the 0402, 0603, and 0805 case sizes will be featured. The devices are designed to reduce signal loss and energy consumption in applications such as VoIP networks; cellular base stations; and satellite, WiFi (802.11), and WiMAX (802.16) wireless communication.
At IMS2015, Vishay Dale Thin Film will be highlighting a wide range of precision thin film resistor chips and networks, including devices with high frequency response to 40 GHz; high power ratings to 22 W; low TCR of 5 ppm/°C; high operating temperatures to +250 °C; AEC-Q200 qualification; and epoxy-bondable terminations.
Vishay Dale Electro-Films (EFI) will feature surface-mount thin film RF capacitors with low DCR and high Q for impedance matching circuits. The products include thin film resistors in the compact 0402 case size for amplifiers, oscillators, and attenuators; and thin film RF spiral inductors with low parasitic capacitance for RF tuning circuits and lumped element filters.
Vishay EFI will also highlight custom substrates with sidewall patterning. Ideal for high-frequency circuits in RF applications and high-bit-rate transceivers, the substrates feature a plate thickness of ≤ 0.025 inches and minimum gap of 0.003 inches, and they are available in a variety of metal systems. In addition, wire-bondable thin film 50 Ω micro-strip transmission lines will be highlighted for test and measurement applications.
Part of International Microwave Week, IMS is the world’s premier microwave conference. It features a large trade show, technical sessions, interactive forums, workshops, short courses, and panel sessions covering a wide range of topics, including wireless communication, RF technologies, microwave electronics and applications, and more. More information on IMS2015 is available at http://www.ims2015.org/.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers
of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors,
and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial,
computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product
innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can
be found on the Internet at www.vishay.com.