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For more information:
Media contact -  Andrew Post, Sr. Manager, Global Communications
Phone:  1.610.251.5287 
Fax:  1.610.889.9429 
E-mail:  andrew.post@vishay.com

Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at OFC 2016

Technology Lineup to Include Custom Submounts and Substrates, RF Capacitors, and Wire-Bondable Products


OFC 2016
For more information:
Media contact -  Andrew Post, Sr. Manager, Global Communications
Phone:  1.610.251.5287 
Fax:  1.610.889.9429 
E-mail:  andrew.post@vishay.com

MALVERN, Pa. — March 11, 2016 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2016 Optical Fiber Communications Conference and Exhibition (OFC 2015), taking place March 20-24 at the Anaheim Convention Center in Anaheim, California. In booth 2712, products on display will include a wide range of Vishay EFI custom submounts, custom substrates with sidewall patterning, high-performance RF capacitors, and wire-bondable devices.

Featured submounts at OFC 2016 will include Vishay EFI’s AlN (aluminum nitride), BeO (beryllium oxide), and Al203 (aluminum oxide) ceramic substrates, which offer gold-filled vias and laser-machined shapes. Integrated AuSn solder patterns are available with 80/20 composition and thickness from 2 m to 8 m. The submounts can be supplied with integrated tantalum nitride and nichrome thin film resistors, capacitors, or inductors.

Also on display will be Vishay EFI’s custom substrates with sidewall patterning. Ideal for custom circuits in electro-mechanical or electro-optical applications, high-frequency circuits in RF applications, and high-bit-rate transceivers (TOSA/ROSA), the substrates feature plate thicknesses from 0.010 in. to 0.050 in., a minimum line width and gap of ≥ 0.003 in., and tight line width and gap tolerances down to 0.001 in. The substrates are available in a variety of metal systems, including TiW / Au / Au plate, TiW / Au / Ni plate / Au plate, and Cr / Cu / Cu plate / Ni plate / Au plate.

For impedance matching circuits, decoupling, DC blocking, and lumped element filters, Vishay EFI will be highlighting its RFCS surface-mount thin film RF capacitors. The devices feature capacitance from 0.2 pF to 27 pF, low DCR, and high Q and SRF. Highlighted wire-bondable products will include resistors with TCR to 25 ppm/C and power ratings to 1 W; resistor networks with tolerances to 0.05 %; single and binary capacitors; and inductors with inductance from 3 nH to 150 nH.

The OFC is the largest global conference and exposition for optical communications and networking professionals. More information on the event is available at http://www.ofcconference.org/en-us/home/.

Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world's largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can be found on the Internet at www.vishay.com.

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For more information:
Media contact -  Andrew Post, Sr. Manager, Global Communications
Phone:  1.610.251.5287 
Fax:  1.610.889.9429 
E-mail:  andrew.post@vishay.com