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Vishay Intertechnology to Showcase Leading High-Frequency MLCCs, Wire-Bondable and Surface-Mount Resistors, and Custom Substrates at IMS2016
MALVERN, Pa. — May 13, 2016 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology lineup for the 2016 IEEE MTT International Microwave Symposium (IMS2016), being held from May 22-27 at Moscone Center in San Francisco. At the conference and exhibition, the company will be highlighting its latest industry-leading high-frequency multilayer ceramic chip capacitors (MLCCs); surface-mount and wire-bondable thin film products; and custom substrates.
Manufactured in noble metal electrode (NME) technology with a wet build process, Vishay Vitramon high-frequency MLCCs feature Q > 2000, ultra-low ESR, tight capacitance tolerance down to ± 0.05 pF, and are available with lead (Pb)-free, lead (Pb)-bearing, and non-magnetic copper terminations. In booth 722, QUAD high-power devices in the 0505, 1111, 2525, and 3838 case sizes will be on display. The MLCCs are optimized for a wide range of high-frequency RF applications, including MRI coils and generators, RF instrumentation, and impedance matching networks.
In addition, Vishay Vitramon’s surface-mount MLCCS in the 0402, 0603, and 0805 case sizes will be featured, which offer an extended operating temperature range from -55 °C to +200 °C and an ultra-stable dielectric material with an excellent aging rate of 0 % per decade. The devices are designed to reduce signal loss and energy consumption in applications such as VoIP networks, cellular base stations, and satellite, WiFi (802.11), and WiMAX (802.16) wireless communication.
At IMS2016, Vishay Dale Thin Film will be highlighting a wide range of precision thin film resistor chips and networks, including devices with high-frequency performance to 40 GHz; high power ratings to 6 W; low TCR of 25 ppm/°C; and tolerances of 0.1 %. Vishay Electro-Films (EFI) will feature thin film tantalum nitride microwave resistors in the 0402 and 0201 case sizes. Featuring an alumina substrate, resistance ranges from 20 Ω to 20 kΩ, and microwave resistance ranges from 20 Ω to 1 kΩ, the devices are ideal for amplifiers, oscillators, attenuators, and couplers. In addition, wire-bondable thin film 50 Ω micro-strip transmission lines will be on display for test and measurement applications, high-frequency hybrid assemblies, and RF bread-boarding.
Vishay EFI will also highlight custom substrates with sidewall patterning. Ideal for high-frequency circuits in RF applications and high-bit-rate transceivers, the substrates feature a plate thickness up to 0.050 in. and minimum line and width gap of 0.003 in. with a tolerance down to ± 0.001 in., and they are available in a variety of metal systems.
Part of International Microwave Week, IMS is the world’s premier microwave conference. It features a large trade show, technical sessions, interactive forums, workshops, short courses, and panel sessions covering a wide range of topics, including wireless communication, RF technologies, microwave electronics and applications, and more. More information on IMS2016 is available at http://ims2016.org/.
Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that
are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace,
and medical markets. Serving customers worldwide, Vishay is The DNA of tech.TM Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). More on Vishay at www.vishay.com.