Vishay Intertechnology to Showcase Leading Passive Components and Custom Substrates at IMS2018
Featured Devices to Include High Frequency MLCCs, Surface-Mount Resistors, RF Capacitors, and Wire Bondable RF Inductors
MALVERN, Pa. — June 5, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology lineup for the 2018 IEEE MTT International Microwave Symposium (IMS2018), being held from June 10-15 at the Pennsylvania Convention Center in Philadelphia, Pennsylvania, in booth 1412. At the conference and exhibition, the company will be highlighting its latest industry-leading high frequency multilayer ceramic chip capacitors (MLCCs); specialty and RF thin and thick film resistors; wire bondable RF capacitors and inductors; and custom substrates.
Manufactured in noble metal electrode (NME) technology with a wet build process, Vishay Vitramon surface-mount high frequency MLCCs feature Q > 2000 and capacitance tolerance as tight as ± 0.05 pF, and they are available with lead (Pb)-free, lead (Pb)-bearing, and non-magnetic copper terminations. In booth 1412, QUAD high power devices in the 0505, 1111, 2525, and 3838 case sizes will be on display for a wide range of high frequency applications, including MRI coils and generators, RF instrumentation, and impedance matching networks. Highlighted leaded MLCCs will feature microstrip, axial ribbon, and radial ribbon configurations.
In addition, Vishay Vitramon’s high temperature surface-mount MLCCs in the 0402, 0505, 0603, 0805, and 1111 case sizes will be on display. The devices offer an operating temperature range from -55 °C to +200 °C and an ultra stable dielectric material with an excellent aging rate of 0 % per decade. The devices are designed to reduce signal loss and energy consumption in applications such as cellular base stations, satellite and broadband communication, and wireless devices.
At IMS2018, Vishay Dale Thin Film will be highlighting a wide range of surface-mount precision thin film resistor chips, including devices with high frequency performance to 40 GHz; high power ratings to 6 W; low TCR of 5 ppm/°C; high temperature operation to +250 °C; enlarged backside terminations to reduce thermal resistance; and epoxy bondable devices with resistance from 1 Ω to 3 mΩ. Vishay Dale thick film chip resistors on display will include devices in the 0505, 0603, 1206, and 2512 case sizes with high power ratings up to 22 W.
Highlighted Vishay Electro-Films (EFI) thin film components will include tantalum nitride microwave resistors in the 0201 and 0402 case sizes. Featuring alumina substrates, resistance from 2 Ω to 20 kΩ, and microwave resistance from 20 Ω to 500 Ω, the devices are ideal for amplifiers, oscillators, attenuators, couplers, and filters. In addition, wire bondable RF capacitors and spiral inductors offering low DCR and high Q will be exhibited.
Vishay EFI will also display custom substrates with sidewall patterning. Devices on display will include bare substrates and metallized plates in a variety of metal systems; conductor patterned substrates with wire bondable, solderable, and epoxy-attach assembly options; resistor conductor patterned substrates; and Au-filled vias, wraps, and cutout metal patterned substrates.
Part of International Microwave Week, IMS is the world’s premier microwave conference. It features a large trade show, technical presentations, workshops, and seminars covering a wide range of topics, including wireless communication, RF technologies, microwave electronics and applications, and more. More information on IMS2018 is available at https://ims2018.org.
Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.® Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). More on Vishay at www.vishay.com.