SMD arc-over supression solution. Requires no conformal coating of the PCB.

VBUS051BD-HD1: An LLP1006 package with side solderability to avoid the need for x-ray inspection.

Low-profile, enhanced surface-mount packages for rectifiers and TVS. High power density with special wide bottom plate designs.

Miniature (5 mm x 5 mm) surface-mount inductor. High-current, high-inductance, low-profile device.

TNPW 0603 e3 and MCT 0603 AT. High pulse load and long-term stability devices.

New breakthrough lowers R_{DS (on)}. Lowest max. on-resistance at V_GS = 4.5 V for 30 V in SO-8 footprint.

Industry's smallest MOSFETs. Industry's lowest on-resistance for chipscale MOSFETs.

Industry's first commercial Trench MOS barrier Schottky. Reduced switching loss improves power efficiency.

Higher system frequency efficiency, lower power loss,
high T_j.

Analog integrated circuit.

TEMT6200FX01: The Industry's smallest light sensor - 0805 package. Controls LCD intensity with "human eye-like" response to light.