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Si5517DU product information

N- and P-Channel 20-V (D-S) MOSFET
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Documents

Datasheet
General Information
General Information - Useful Web Links
Markings
PART MARKING - 1206-8 ChipFET and PowerPAK ChipFET
Package Drawings
Package Information - PowerPAK® ChipFET® Case Outline
Pad Guidelines
Application Note 826 - RECOMMENDED minimum pads FOR PowerPAK® ChipFET® Dual
RC Thermal Models
si5517du-rc - RC Thermal Model for Si5517DU
Reel Info
Reliability Data
Package Reliability - Environmental and Package Testing Data for PowerPAK® ChipFET®
Silicon Technology Reliability - N-Channel Accelerated Operating Life Test Result
Silicon Technology Reliability - P-Channel Accelerated Operating Life Test Result
Tape Info
PACK-0007-13 - Device Orientation for 1206-8 ChipFET (T1)
Tape Information - PowerPAK® ChipFET®
SPICE Models (*.pdf)
Si5517DU-DS - DS-Spice Model for Si5517DU
HSPICE Models (*.txt)
si5517du-h - H-Spice Model for Si5517DU
PSpice Models (*.lib)
si5517du-p lib - LIB for P-Spice Model for Si5517DU
PSpice Models (*.olb)
si5517du-p olb - OLB for P-Spice Model for Si5517DU
PSpice Models (*.txt)
si5517du-p - P-Spice Model for Si5517DU
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