TDP product information

Molded, Dual-In-Line Thin Film Resistor, Through Hole Network

 Datasheet

FEATURES

Standard rugged, molded case construction (14 pins and 16 pins)
Highly stable thin film (500 ppm at +70 °C at 2000 h)
Low temperature coefficient (± 25 ppm/°C)


If you haven't already registered, you must register to submit a request.
* = required
* Part Number
* Part Description
Doc ID
* Quantity
* Project Name
* Estimated Annual Use
Customer Material Number
Start of Production
 
Notes