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High Reliability Thick Film Resistor, Surface Mount Chip

 M Datasheet

FEATURES

  • High purity alumina substrate for high power dissipation (2 W max.)
  • Wraparound terminations featuring a thin film adhesion layer covered with a leach resistant nickel barrier layer for +150 C operating conditions
  • High speed laser trimming for high volume requirements


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Documents

Datasheet
Lead Free
Lead-Free Family Summary Sheet - Resistor Components - Resistor and Plasma Display Lead-Free Product Family-2011
Packaging Information
Waffle Pack Packaging - Waffle Pack Packaging
Pad Guidelines
Land Patterns - Vishay Dale Thin Film Land Patterns
Product Literature
Instructional Guide - Resistors 101 - Instructional Guide
Selector Guide - Vishay Dale Thin Film Chip Overview: Resistive Solutions for a Wide Range of Industries
Tape and Reel Info
Tape and Reel Specifications - 8 mm, 12 mm, 16 mm, and 24 mm Embossed Conductive Tape Conforming to EIA-481
Technical Notes
Technical Note - Drift Calculation for Thin Film Resistors
Technical Note - Pulse Load Handling for Fixed Linear Resistors
Technical Note - Vishay Thin Film Lead Free Wraparound Process
Technical Note - Drift Calculation for Thin Film Resistors
Technical Note - Pulse Load Handling for Fixed Linear Resistors
技术说明 - 线性固定电阻器的脉冲载荷处理 - Pulse Load Handling for Fixed Linear Resistors
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