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CSD product information

Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom)

 Datasheet

FEATURES

Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
Monolithic construction
Ceramic package with no cavity. 4 pins to 20 pins.



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