English 
简体中文 
日本語 RCP product information
Thick Film Chip Resistors, Industrial, High Power, Aluminum Nitride Substrate
FEATURES
Thick film resistive element on an aluminum nitride (AlN) substrates
Very high thermal conductivity in a small package size
Termination: tin / lead wraparound termination over nickel barrier. Also available with lead (Pb)-free wraparound terminations.
Share
