MALVERN, Pa. — Mar. 6, 2018 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2018 Optical Fiber Communications Conference and Exhibition (OFC 2018), taking place March 11-15 at the San Diego Convention Center. In booth 2431, products on display will include a wide range of Vishay EFI custom submounts and substrates, in addition to thin film RF capacitors and spiral inductors, microwave resistors, and resistor chips for hybrid assemblies.

Featured submounts at OFC 2018 will include Vishay EFI’s AlN (aluminum nitride), BeO (beryllium oxide), and Al2O3 (aluminum oxide) ceramic substrates, which offer gold-filled vias and laser-machined shapes. Integrated AuSn solder patterns are available with 80 / 20 composition and thickness from 4.5 µm to 7 µm. Highlighted custom substrates with sidewall patterning and integrated resistors, capacitors, or inductors are available in a variety of metal systems for custom circuits in electro-mechanical or electro-optical applications, high frequency circuits in RF applications, and high bit rate transceivers (TOSA/ROSA).

Vishay EFI thin film components on display will include surface-mount RF capacitors with capacitance from 0.6 pF to 27 pF for impedance matching circuits, decoupling, DC blocking, and lumped element filters. For amplifiers, oscillators, attenuators, couplers, and filters, Vishay will highlight microwave resistors with resistance from 20Ω to 500Ω and high frequency, wire bondable RF spiral inductors with inductance from 3.9 nH to 150 nH. For hybrid assemblies in high moisture environments, top- and bottom-contact wire bondable resistors on display will feature power to 250 mW and resistance from 10Ω to 1 MΩ in compact case sizes.

The OFC is the largest global conference and exhibition for optical communications and networking professionals. More information on the event is available at http://www.ofcconference.org/en-us/home/.