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For more information:
Media contact -  Bob Decker, Red Pines Group
Phone:  1.415.409.0233 
Fax:  1.650.618.1512 
E-mail:  bob.decker@redpinesgroup.com

Sales contact: 

New Vishay Intertechnology ThermaWickTM SMD Thermal Jumper Chip Removes Heat From Electrically Isolated Components

Device Reduces Component Temperature by Over 25 %, Enabling Higher Power Handling Capability or Longer Useful Life  


Products mentioned:

THJP
For more information:
Media contact -  Bob Decker, Red Pines Group
Phone:  1.415.409.0233 
Fax:  1.650.618.1512 
E-mail:  bob.decker@redpinesgroup.com

Sales contact: 

This release in:

MALVERN, Pa.April 6, 2020 — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the ThermaWickTMTHJP series surface-mount thermal jumper chip. The Vishay Dale Thin Film device allows designers to transfer heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.

Featuring an aluminum nitride substrate with high 170 W/m°K thermal conductivity, the chip released today is capable of reducing the temperature of connected components by over 25%. This reduction allows designers to increase the power handling capability of these devices or extend their useful life at existing operating conditions, while maintaining the electrical isolation of each component. By protecting adjacent devices from thermal loads, overall circuit reliability is improved.

The THJP’s low capacitance down to 0.07 pF makes it an excellent choice for high frequency and thermal ladder applications. The thermal conductor will be used in power supplies and converters; RF amplifiers; synthesizers; pin and laser diodes; and filters for AMS, industrial, and telecommunications applications.

The device is available in six case sizes from 0603 to 2512, with custom sizes available. The 0612 and 1225 cases feature long side terminations for additional heat transferring capability. The thermal jumper is available with lead (Pb)-bearing and lead (Pb)-free wraparound terminations.

Device Specification Table:

Case size

Thermal resistance (°C/W)

Thermal conductance (mW/°C)

Capacitance (pF)

0603

14

70

0.07

0612

4

259

0.26

0805

13

77

0.15

1206

15

65

0.07

1225

4

259

0.26

2512

15

65

0.07

Samples and production quantities of the ThermaWickTM THJP series thermal jumper will be available in Q1 2020, with lead times of six weeks.

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.TM Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). More on Vishay at www.vishay.com.

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ThermaWick is a trademark of Vishay Intertechnology

For more information:
Media contact -  Bob Decker, Red Pines Group
Phone:  1.415.409.0233 
Fax:  1.650.618.1512 
E-mail:  bob.decker@redpinesgroup.com

Sales contact: 

This release in:

  • lang-code-EN
  • lang-code-DE
  • lang-code-ZH
  • lang-code-JP