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日本語 Die & wafer - Infrared emitting diodes
|
Part Number
|
Package Type
|
Package Form
|
Package Dimensions
(L x W x H) (mm) |
Peak Wavelength
(mm) |
Radiant Power
(mW) |
Angle of Half Intensity
(±°) |
Rise Time
(ns) |
|
|---|---|---|---|---|---|---|---|---|
  |
chip | chip | 0.2 x 0.2 x 0.19 | 940 | 3.5 | 80 | 15 | |
|
|
chip | chip | 0.37 x 0.37 x 0.19 | 940 | 21 | 80 | 15 | |
|
|
chip | Chip | 0.260 x 0.260 x 0.17 | 855 | 18 | 60 | 10 | |
|
|
chip | Chip | 0.355 x 0.355 x 0.17 | 855 | 38 | 60 | 10 | |
|
|
chip | Chip | 0.260 x 0.260 x 0.17 | 940 | 20 | 60 | 10 | |
|
|
chip | Chip | 0.355 x 0.355 x 0.17 | 940 | 40 | 60 | 10 |
