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Extreme Temperature & Thermal Management

Customer Challenge
Our customers systems operate from cryogenic to hypersonic temperatures, while some require us to remove heat from dense active devices.

What Thin Film Solves

  • Direct heat extraction through substrate and metal filled via thermal paths
  • CTE match and stable performance at temperature extremes
  • Advanced thermal materials placed only where needed

Advanced thermal features often allow lower cost substrates to meet high temperature limits.

Series Name
Case Study

Hermetic Ka‑Band GaN Amplifier Packaging

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