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Harsh Environments

Customer Challenge
Designs must maintain electrical and mechanical stability through shock, vibration, thermal cycling, radiation, contamination, and long qualification cycles.

What Thin Film Solves

  • Inert ceramic substrates with sputtered metallization for long term reliability
  • Hermetic, rugged interconnects for SMT and advanced packaging
  • Controlled build to print processes support qualification programs

Hermetic, filled‑via interconnects and ceramic substrates maintain stability through severe environmental stress

Series Name
Case Study

High Frequency Radar Performance for AESA Upgrade

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