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Simplified Manufacturability & Assembly

Customer Challenge
Complex designs require multiple attachment methods while keeping reliability, yield, and qualification stable — despite variation risks at each assembly step.

What Thin Film Solves

  • Supports solder, eutectic (AuSn), sintering, wire bond, and flip chip assembly
  • Uniform metallization enables void-free eutectic bonding
  • Controlled thin film bond lines reduce mechanical alignment variation
  • Precision features enable first-level passive optical alignment

Thin film supports multiple assembly paths without secondary rework.

Series Name
Case Study

Passive Optical Alignment & Eutectic Bonding

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