Die & wafer - Photo Detectors

Die & wafer - Photo detectors

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Part Number	Package Type	Package Form	Package Dimensions L x W x H (mm)	Peak Wavelength λ_p (nm)	Spectral Bandwidth (nm)	Output	Angle of Half Sensitivity φ (± deg)	Photo Sensitive Area (mm²)
T1070P	chip	chip	0.72 x 0.72 x 0.22	570	440 to 800	50 µA	60	0.25
T1090P6	chip	chip	0.52 x 0.52 x 0.185	840	620 to 1000	65 µA to 750 µA	60
T1110P6	chip	Chip	2.97 x 2.97 x 0.28	940	430 to 1100	55 µA	60	7.5
T1112P	chip	Chip	3.05 x 2.1 x 0.28	970	640 to 1070	44 µA	60	5.5
T1113P	chip	Chip	2.97 x 2.97 x 0.28	960	660 to 1050	55 µA	60	7.5
T1116P	chip	Chip	2.97 x 2.97 x 0.28	940	350 to 1100	43 µA	60	7.7
T1120P	chip	Chip	2.37 x 2.37 x 0.28	940	430 to 1100	35 µA	60	4.4
T1170P	chip	chip	1.17 x 1.17 x 0.28	920	600 to 1040	7 µA	60	0.88
T1172P6	chip	Chip	1.47 x 1.07 x 0.28	960	640 to 1060	8.7 µA	60	1.06
T1180P6	chip	Chip	0.67 x 0.3 x 0.28	810	590 to 1010	0.59 µA	60	0.055
T1187P6	chip	Chip	0.67 x 0.3 x 0.28	800	580 to 1070	0.66 µA	60	0.053
T1610P	chip	Chip	2.97 x 2.97 x 0.28	560	390 to 800	2.9 µA	60	7.7
T1670P	chip	Chip	0.72 x 0.72 x 0.28	560	390 to 800	138 nA	60	0.27
T1677P	chip	Chip	0.72 x 0.72 x 0.28	570	430 to 700	15 nA	60	0.27
T1678P	chip	Chip	0.72 x 0.72 x 0.2	570	440 to 700	15 nA	60	0.34
T330P	chip	Chip	0.67 x 0.67 x 0.28	900	430 to 1100	2.3 µA	60	0.23
T337P6	chip	Chip	0.67 x 0.67 x 0.28	970	610 to 1080	2.3 µA	60	0.23
T5096P	chip	Chip	0.39 x 0.39 x 0.185	910	480 to 1080	200 µA to 310 µA	60

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