FILLED AND PLATED VIAS
Vishay EFI uses both plated thru-holes and solid gold filled vias to make connections between the top and bottom of parts. In both techniques, holes are drilled into the substrate using a CO2 laser before metal processing.
For plated thru-holes the sidewalls of the open vias are coated with sputtered metal and then electroplated. For filled vias a proprietary process allows EFI to fill the via with pure thin film gold. These vias are electrically and thermally conductive so they can make electrical contact to the backside ground plane, or components can be mounted near the filled via which then carries heat through the substrate to the heatsink or board below. For more information please see INT product page.
Solid Metal Filled Vias Thermal conductivity Via Diameter [mil (mm)] Via Center to Via Center Min Via Edge to Circuit Edge Conductor Annmular Ring [mil (mm)] 300 W/mk 0.7 - 1.5 x Substrate thickness (Min 0.007" - Max 0.40") 2 x via diameter 0.0025" (0.1 mm) Via diameter + 5 (0.127)
Plated Thru-Holes Hole Diameter [mil (mm)] Hole Center to Hole Center Mid Hole Edge to Circuit Edge Min Tolerance from Hole Center to Pattern Edge 0.8 - 2.0 X Substrate Thickness 2 x hole diameter 0.005" (mm) +/- 0.002" (mm)