Substrates Resistor Material Metallization Options Mounting Options Filled and Plated Vias Thick Copper Plating Sputtered AuSn Cutouts and Special Shapes Sidewall Patterning
Vishay EFI has developed the thin film processing technology to pattern conductors on four surfaces of a substrate and includes the top and bottom surfaces as well as up to two parallel sidewalls. The conductor metallization offered can be either wirebondable or solderable and can integrate resistors and AuSn pads on the top side.
Sidewall patterning is used in electro-mechanical or electro-optical applications that require an interface between the electrical circuit and an element such as a mirror, lens or fiber. This technology is also used in high frequency circuits and high bit rate transceivers that benefit by replacing wire bonds with side-patterned traces and in applications that require a high degree of miniaturization. View our SDWP product page