Testing and Inspection
Vishay EFI tests all resistors, capacitors and inductors for electrical tolerance. In addition, all products are visually inspected per MIL-STD-883, M2032 Class H or K. EFI also offers a commercial visual inspection for non-critical applications.
Additional sample testing is available for most environmental specifications; all testing is done in accordance with MIL-PRF-55342 or MIL-PRF-38534. Vishay EFI has the ability to provide a wide variety of testing on site with documentation assures that EFI products have the highest levels of reliability and performance for challenging applications.
| Item |
Test |
Specification Method |
Quantity Tested** |
| 1 |
DC Resistance |
MIL-PRF-55342 PARA. 4.8.2 |
100% |
| 2 |
Thermal Shock |
MIL-PRF-55342 PARA. 4.8.3 |
100%* |
| 3 |
DC Resistance |
MIL-PRF-55342 PARA. 4.8.2 |
100% |
| 4 |
Visual/ Mechanical Inspection |
MIL-STD-883 METHOD 2010 |
100% |
| MIL-PRF-55342 Group A - Space Level |
| Item |
Test |
Specification Method |
Quantity Tested** |
| 1 |
DC Resistance |
MIL-PRF-55342 PARA. 4.8.2 |
100% |
| 2 |
Thermal Shock |
MIL-PRF-55342 PARA. 4.8.3 |
100%* |
| 3 |
Power Conditioning |
MIL-PRF-55342 PARA. 4.8.4 |
100% |
| 4 |
DC Resistance |
MIL-PRF-55342 PARA. 4.8.2 |
100% |
| 5 |
Visual/ Mechanical Inspection |
MIL-STD-883 METHOD 2010 |
100% |
| Item |
Test |
Specification Method |
Quantity Tested** |
| 1 |
TCR |
MIL-PRF-55342 PARA. 4.8.10 |
20 (0) |
| 2 |
Short Time Overload |
MIL-PRF-55342 PARA. 4.8.6 |
20 (0) |
| 3 |
Power Conditioning |
MIL-PRF-55342 PARA. 4.8.4 |
20 (0) |
| 4 |
Bondability/Bond Integrity
(Gold Wedge Bond) |
MIL-STD-883 METHOD 2011
Condition D |
10 (0) |
| Item |
Test |
Specification Method |
Quantity Tested** |
| 1 |
Thermal Shock Condition F |
MIL-PRF-55342 PARA. 4.8.3 |
30 (1) |
| 2 |
Low Temperature Operation |
MIL-PRF-55342 PARA. 4.8.5 |
30 (1) |
| 3 |
Resistance to Bond |
MIL-PRF-55342 PARA. 4.8.8.2 |
30 (1) |
| 4 |
Moisture |
MIL-PRF-55342 PARA. 4.8.9 |
30 (1) |
| 5 |
High Temperature Exposure
150C 100+/-4hrs |
MIL-PRF-55342 PARA. 4.8.7 |
30 (1) |
| 6 |
Life 70C 2K hr
@Rated Power |
MIL-PRF-55342 PARA. 4.8.11 |
30 (1) |
| Class H Passive Element Evaluation Requirements |
| Test |
Specification Method |
Quantity Tested** |
| Electrical |
MIL-PRF-38534 C.3.4.1 |
100% |
| Visual Inspection |
MIL-PRF-38534 C.3.4.2 |
100% |
| Element Electrical |
MIL-PRF-38534 C.3.4.4 |
100% |
| Wire Bond Evaluation |
MIL-PRF-38534 C.3.4.3 |
100% |
| Class K Passive Element Evaluation Requirements |
| Test |
Specification Method |
Quantity Tested** |
| Electrical |
MIL-PRF-38534 C.3.4.1 |
100% |
| Visual Inspection |
MIL-PRF-38534 C.3.4.2 |
100% |
| Temperature Cycling |
MIL-PRF-38534 C.3.4.3 |
10 (0) |
| Constant Acceleration |
MIL-PRF-38534 |
10 (0) |
| Voltage Conditioning |
MIL-PRF-38534 C.3.4.7 |
10 (0) |
| Visual Inspection |
MIL-PRF-38534 C.3.4.5 |
10 (0) |
| Element Electrical |
MIL-PRF-38534 C.3.4.4 |
10 (0) |
| Wire Bond Evaluation |
MIL-PRF-38534 C.3.4.3 |
10 (0) |
| Class H and K Substrate Evaluation Requirements |
| Test |
Specification Method |
Quantity Tested** |
| Electrical |
MIL-PRF-38534 C.3.7.3 |
100% |
| Visual Inspection |
MIL-STD-883 METHOD 2032 |
100% |
| Physical Dimensions |
MIL-STD-883 METHOD 2016 |
5 (0) |
| Visual Inspections |
MIL-STD-883 METHOD 2032 |
5 (0) |
| Electrical |
MIL-PRF-38534 C.3.7.5.1.3 |
5 (0) |
| Conductor Thickness or Conductor Resistivity |
MIL-PRF-38534 C.3.7.5.2.1 |
3 (0) |
| Film Adhesion |
MIL-PRF-38534 C.3.7.5.2.3 |
3 (0) |
| Solderability |
MIL-PRF-38534 C.3.7.5.2.4 |
3 (0) |
| TCR |
MIL-PRF-38534 C.3.7.5.3.1 |
2 (0) |
| Wire Bond Evaluation |
MIL-STD-883 METHOD 2011 |
10 (0) or 20 (1) wires |
| Die Shear Evaluation |
MIL-STD-883 METHOD 2019 |
2 (0) |
For a copy of the testing capabilities, download our Vishay Electro-Films Testing Capabilities document
*All parts get baked and electrically tested to remain in tolerance. Sample has delta R measured pre- and post-bake.
** Number in parenthesis is the number of allowed failures
