THICK COPPER PLATING
Vishay EFI offers Thick Copper plating which is beneficial for thermal management and power management.
Our wide range of photoresist options allow for both thick copper traces for high power lines and selectively plated thinner gold RF lines on the same substrate. EFI’s copper plating can be as thick as 4 mils.
Thick Copper Design Rules Maximum Cu Thickness 400 u" (10.2 um)
800 u" (20.3 um) 1000 u" (25.4 um) 2000 u" (51 um) 4000 u" (102 um) Cu Thickness Tolerance 100 u" 150 u" 250 u" 500 u" 1000 u" Minimum Line and Space 0.5 mil / 0.5 mil 1 mil / 1 mil 2 mil / 2 mil 3 mil / 3 mil 4 mil / 4 mil Line Width Tolerance 0.20 mil 0.30 mil 1.0 mil 2.0 mil 3.0 mil