CSOM PRODUCT INFORMATION

Sandwich, 25 mil Pitch, Dual In-Line Thin Film Resistor, Surface Mount Network
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FEATURES

Lead (Pb)-free gold plated terminals standard
Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
Tighter tolerances than molded standards (0.01 %)


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Datasheet
Sandwich, 25 mil Pitch, Dual In-Line Thin Film Resistor, Surface Mount Network
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