SFP PRODUCT INFORMATION

Thin Film Top-Contact Resistor with Part Mark
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pdf-icon-small Datasheet

FEATURES

Wire bondable
Part marked - 5 digits
Small size: 0.022 inches square

APPLICATIONS

Vishay EFI SFP small resistor chips are widely used in hybrid packages where space is limited and chip value marking is important for identification. The die is part marked with the resistance value. Wire bonding is made to the two pads on the top of the chip.


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Datasheet
Thin Film Top-Contact Resistor with Part Mark
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General Information
Vishay Electro-Films Testing Capabilities
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Packaging Information
Vishay Electro-Films Waffle Pack Quantity Per Product Family
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Product Literature
Military and Aerospace Applications
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