BCR PRODUCT INFORMATION

Thin Film, Back-Contact Resistor
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pdf-icon-small Datasheet

FEATURES

Wire bondable
Only one wire bond required
Small size: 0.020 inches square

APPLICATIONS

Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectic or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip.)


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Datasheet
Thin Film, Back-Contact Resistor
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General Information
Starter Sample Kit Wirebondable Thin Film Chip Resistors
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General Information
Vishay Electro-Films Testing Capabilities
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Packaging Information
Vishay Electro-Films Waffle Pack Quantity Per Product Family
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Product Literature
Military and Aerospace Applications
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Product Literature
Model BCR - Thin Film, Back-Contact Resistor
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Product Literature
Wire Bondable Passive Components Product Family
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