PSC PRODUCT INFORMATION

High Frequency RF Spiral Inductor for Wire Bonded Assemblies
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pdf-icon-small Datasheet

FEATURES

Wire bond assembly
Small size: 45 mils x 45 mils x 10 mils
Low DCR, high Q

APPLICATIONS

RF choking for DC biasing
RF tuning circuits
Lumped element filters


Showing 1 to 4 of 4 entries
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Datasheet
High Frequency RF Spiral Inductor for Wire Bonded Assemblies
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General Information
Vishay Electro-Films Testing Capabilities
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Product Literature
Wire Bondable Passive Components Product Family
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Product Literature
インダクタ - Surface Mount and Axial Lead Inductors
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