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Diodes & Rectifiers

Advantages
  • Space-saving, high power density packages
  • Excellent heat dissipation
  • Enhanced current rating
Applications
  • Artificial intelligence
  • Factory automation and robotics
  • Automotive
  • Aerospace and defense

Power Rectifiers

  • Enhanced isoCink+™ and low forward voltage GBUE2560-M3 bridge rectifiers deliver outstanding system efficiency
  • High voltage FRED Pt® rectifiers are available with high CTI molding compound to allow shorter creepage distances
  • TMBS® (Trench MOS Barrier Schottky) Technology increases power density and efficiency
  • Conventional surface-mount SMA, SMB, and SMC packages available for standard, fast, and ultrafast recovery (including FRED Pt®) and Schottky (including TMBS®) Rectifiers
DO-218AB
DO-218AB
1200 V Standard Rectifiers
SMA (DO-214AC)
SMA (DO-214AC)
Power Rectifiers
SMB (DO-214AA)
SMB (DO-214AA)
Power Rectifiers
SMC (DO-214AB)
SMC (DO-214AB)
Power Rectifiers
FlatPAK 5 x 6
FlatPAK 5 x 6
170 V Schottky Rectifiers
FlatPAK 5 x 6
FlatPAK 5 x 6
Up to 200 V TMBS® Rectifiers
GBU
GBU
Low VF Bridge Rectifiers
GSIB Bridge
GSIB Bridge
Low VF Bridge Rectifiers
PB Series
PB Series
Enhanced isoCink+™ Bridge Rectifiers
TO-220AC 2L, TO-247AD 2L
TO-220AC 2L, TO-247AD 2L
600 V FRED Pt® Gen5
TO-220AB 3L, TO-247AD 3L
TO-220AB 3L, TO-247AD 3L
1200 V FRED Pt® Gen5

Silicon Carbide (SiC) Schottky

  • 650 V and 1200 V SiC Schottky rectifiers
  • Package design with high CTI molding compound available for enhanced creepage performance
  • SiC merged PIN Schottky (MPS) diode design for high power applications
D<sup>2</sup> PAK 2L (TO-263AB 2L)
D2 PAK 2L (TO-263AB 2L)
650 V and 1200 V, 4 A to 20 A
SlimSMA HV (DO-221AC)
SlimSMA HV (DO-221AC)
650 V and 1200 V, 1 A and 2 A
TO-247AD 2L 10 A to 30 A
TO-247AD 2L 10 A to 30 A
650 V and 1200 V, 2 A x 5 A to 2 A x 30 A
TO-220AC 2L
TO-220AC 2L
650 V and 1200 V, 4 A to 20 A
TO-247AD 3L
TO-247AD 3L
650 V and 1200 V, 10 A to 30 A

Small Signal Diodes

  • Wide selection for a variety of applications
  • Industry-standard packages
  • Planar wafer technology for low leakage and reliability
  • Products are green — RoHS compliant, halogen-free, antimony < 900 ppm
  • FlipKY® Gen 2 offered in ultra Chip Level Package (CLP)
CLP Packages
CLP Packages
FlipKY® Gen 2 Schottky Diodes
SOD-123
SOD-123
Zener Diodes, Switching and Schottky Diodes
SOD-323
SOD-323
Zener Diodes, Switching and Schottky Diodes
SOD-523
SOD-523
Zener Diodes, Schottky Diodes
SOT-23
SOT-23
Zener Diodes, Switching and Schottky Diodes

Transient Voltage Suppressors (TVS)

  • Industry-first snapback type XClampR® TVS for junction temperatures up to 175 °C
  • PAR® TVS for junction temperatures up to 185 °C
  • TRANSZORB® TVS offers a broad stand-off voltage range up to 495 V

Automotive Grade

SMC (DO-214AB)
SMC (DO-214AB)
XClampR TVS

AEC-Q101 Qualified

DO-214AB
DO-214AB
AEC-Q 101 Qualified
DO-218AB
DO-218AB
XClampR® TVS

DFN Series

  • Side-wettable flanks for easy AOI
  • Robust solder joints
  • High reliability
DFN1006-2A
DFN1006-2A
DFN Series
DFN1006-2B
DFN1006-2B
DFN Series
DFN33A
DFN33A
DFN Series
DFN3820A
DFN3820A
Industry first
DFN1110-3A
DFN1110-3A
DFN Series
DFN6546A
DFN6546A
Industry first

ESD Protection

  • Low leakage current and capacitance for high isolation
  • Industry-leading advantages of the LLP package
  • CLP technology is offered in bare die, flip chip, and silicon package formats
CLP Series CLP0603-2L
CLP Series CLP0603-2L
Interchangeable With Industry-Standard Footprints
LLP Series LLP1006-2L
LLP Series LLP1006-2L
Interchangeable With Most Standard Footprints
LLP Series LLP1006-2M
LLP Series LLP1006-2M
Very Low CD: 0.3 pF; Bidirectional Symmetrical
LLP Series LLP75-6L
LLP Series LLP75-6L
Low profile < 0.6 mm; 4-line USB ESD protection
LLP Series LLP1010-6M
LLP Series LLP1010-6M
Low Profile < 0.4 mm; 4-Line USB ESD Protection
LLP Series LLP1713-7L
LLP Series LLP1713-7L
2-Line ESD Protection With Flow-Through Design
LLP Series LLP75-7L
LLP Series LLP75-7L
Low profile < 0.6 mm; 3-line USB ESD protection; VRWM = 5.5 V

eSMP® Series

  • Industry first
  • Industry-leading low profile package offerings
  • High current up to 60 A and power density to support system downsizing
  • Asymmetrical and symmetrical flat type packages available
MicroSMF (DO-219AC)
MicroSMF (DO-219AC)
eSMP® Series
MicroSMP (DO-219AD)
MicroSMP (DO-219AD)
eSMP® Series
SlimDPAK (TO-252AE)
SlimDPAK (TO-252AE)
eSMP® Series
SlimDPAK 2L
SlimDPAK 2L
eSMP® Series
SlimSMA (DO-221AC) SlimSMA, HV (DO-221AC)
SlimSMA (DO-221AC) SlimSMA, HV (DO-221AC)
eSMP® Series
SlimSMAW (DO-221AD)
SlimSMAW (DO-221AD)
eSMP® Series
SMF (DO-219AB)
SMF (DO-219AB)
eSMP® Series
SMP (DO-220AA)
SMP (DO-220AA)
eSMP® Series
SMPA (DO-221BC)
SMPA (DO-221BC)
eSMP® Series
SMPC (TO-277A)
SMPC (TO-277A)
eSMP® Series
SMPC HV
SMPC HV
eSMP® Series
SMPD (TO-263AC)
SMPD (TO-263AC)
eSMP® Series
SMPD 2L
SMPD 2L
eSMP® Series
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