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PowerPAK® 1212-F

The PowerPAK® 1212-F package delivers best in class on-resistance in a 3.3 mm by 3.3 mm footprint, with source flip technology and a central gate design that simplify layout and enable cooler operation for power circuitry in servers and telecom switches. Compared to the standard PowerPAK 1212, its smaller switching area helps reduce the impact of trace noise, while improved thermal performance supports higher power density.

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PowerPAK 1212-F Product Listing

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SiSD5300DN 30 V MOSFET in PowerPAK® 1212-F

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Run Electronics Cooler With MOSFETs in the PowerPAK® 1212-F

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