Request Sample | Language

Top-Cooled Package Solutions (8x8LR)

Vishay’s top-cooled MOSFET packages move heat out through a metalized top surface, so designers can couple the device to a heatsink, cold plate, or thermal pad without relying only on PCB copper. Options include the PowerPAK® 8 x 8LR, a low-profile leadframe package with very low junction-to-case thermal resistance and an integrated Kelvin source.

Series Name
Product Package

PowerPAK® 8x8LR MOSFETs

Series Name
Sell Sheet

Reduce PCB Temperature and Increase Power Density | Reduce PCB Temperature,
Increase Power Density in Automotive Applications

Series Name
Infographic

600 V PowerPAK® 8 x 8LR + Gen 4 Superjunction MOSFETs

► GET THE LATEST NEWS
About Vishay Who we are News Events Awards Brands Careers Quality
Investor Relations Corporate Overview Executive Management Financials Governance Stock Info
Corporate Responsibility Environmental Overview Ethics RBA Statement Supply Chain Sustainability Whistleblower Procedure
Resources Design Tools Document Library Engineer's Toolbox Infographics My Vishay New Products Reference Designs Technical Support Videos

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.®

Contact Us | | Request Sample | Privacy Center | Do Not Sell or Share My Personal Information | Terms and Conditions | Information Security | Terms of Use | Legal Notice |

CONNECT WITH US

Copyright ©2026 Vishay Intertechnology, Inc.