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Package Advantage

Package Advantage

  • Wide PowerPAK® range for thermal and board efficiency
  • Dual and common-drain options cut component count
  • Compact rugged choices from 30 V to 600 V
  • Top-side cooled PowerPAK® for superior heat management
PowerPAIR<sup>®</sup> 3.3FSWL
PowerPAIR® 3.3FSWL
Reduce Component Counts and Simplify Designs
PowerPAK<sup>®</sup> 10 × 12
PowerPAK® 10 × 12
High Power + High Efficiency + High Power Density
PowerPAK<sup>®</sup> 1212 8SCD
PowerPAK® 1212 8SCD
Integrated Common-Drain Solutions
PowerPAK<sup>®</sup> 1212-F
PowerPAK® 1212-F
Run Cooler and Simplify Designs
PowerPAK<sup>®</sup> 8 x 8L
PowerPAK® 8 x 8L
Enhanced Solder Reliability, Lowest Thermal Impedance
PowerPAK<sup>®</sup> 8 × 8L BWL
PowerPAK® 8 × 8L BWL
Optimized board-level layout
PowerPAK<sup>®</sup> 8 × 8LR
PowerPAK® 8 × 8LR
High Thermal Capability + High Current Density + High Power Density
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