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Ceramic Sandwich, Single-In-Line Thin Film Resistor, Through Hole Network (Low Profile 0.20 Custom)

 CS Datasheet

FEATURES

  • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
  • Low profile (0.200 min.)
  • Custom pin-outs available


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Documents

Datasheet
Lead Free
Lead-Free Family Summary Sheet - Resistor Components - Resistor and Plasma Display Lead-Free Product Family-2011
Ordering Info
Ordering Info - Application Guide Form for Vishay Thin Film
Pad Guidelines
Land Patterns - Vishay Dale Thin Film Land Patterns
Product Literature
Capabilities - Thin Film Resistor Networks - Precision Thin Film Technology
Instructional Guide - Resistors 101 - Instructional Guide
Reference Data
Quick-Net® Prototype - Guidelines
Product Support
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