CS PRODUCT INFORMATION

Ceramic Sandwich, Single-In-Line Thin Film Resistor, Through Hole Network (Low Profile 0.20 Custom)
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FEATURES

Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
Low profile (0.200 min.)
Custom pin-outs available


Showing 1 to 8 of 8 entries
Document TypeTitleDescriptionShare
Datasheet
Ceramic Sandwich, Single-In-Line Thin Film Resistor, Through Hole Network (Low Profile 0.20 Custom)
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General Information
Vishay Dale Thin Film Land Patterns
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General Information
Guidelines
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Ordering Info
Application Guide Form for Vishay Thin Film
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Lead Free
Resistor and Plasma Display Lead-Free Product Family-2011
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Product Literature
Thin Film Resistor Networks - Precision Thin Film Technology
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Product Literature
Resistors 101 - Instructional Guide
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Product Literature
Precision Thin Film Technology
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