CSD PRODUCT INFORMATION

Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom)
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pdf-icon-small Datasheet

FEATURES

Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
Monolithic construction
Ceramic package with no cavity. 4 pins to 20 pins.


Showing 1 to 9 of 9 entries
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Datasheet
Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom)
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