SPF2 PRODUCT INFORMATION

Custom Substrates - Conductor Pattern
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FEATURES

Precision conductor patterns
Metalization on 1 or 2 surfaces
Various substrate materials

APPLICATIONS

Vishay EFI custom specialty films / conductor patterned substrates are used in the hybrid circuit and microwave industries. These conductor patterns are precisely manufactured to be used for complex fan-outs, interconnects, high temperature, and RF / microwave designs. Vishay EFI custom specialty films / conductor patterned substrates can also be used in a wider variety of applications including jumpers, mounting pads, and bonding pads. The custom specialty film / conductor patterned substrates are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The custom specialty film / conductor patterned substrates are visually inspected to MIL-STD-883, method 2032 class H or K.
Vishay EFI offers the option of a sputter deposition of gold-tin solder with wt % of 80 / 20 while maintaining tolerances tighter than ± 2 % wt and control of film thickness to ± 1.0 µm. This capability allows deposition of customer AuSn patterns that can be used to fine-tune assembly processes to meet the most demanding requirements; the tight composition tolerance eliminates the need to adjust reflow process parameters to compensate for variations in solder composition. The gold-tin deposition process allows films with thickness ranging between 4.5 µm and 7 µm with a tolerance of ± 1.0 µm. Common applications for AuSn deposition are laser diode sub-mounts, fiber optic pump lasers, optical transmitters, optical receivers, optical transceivers and optical TOSA / ROSA packages. For further detail, please reference document: AuSn design guideline (www.vishay.com/doc?49248).
When designing hybrid assemblies to operate at temperatures above 125 °C it becomes important to provide monometallic interconnects to prevent intermetallic diffusion and resultant long term reliability problems. For these situations, Vishay Electro-Films (EFI) has developed processes for depositing both aluminum and gold bonding pads on the same


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This data is being provided to you free of charge for your use but remains the sole property of Vishay Intertechnology, Inc. (''Vishay') or Ultra Librarian/EMA Design Automation®, Inc. (collectively, "Company"). This data is being provided as a convenience and for informational purposes only. Inclusion of links to this data on the Vishay website does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of Company. While Vishay and Company have used reasonable efforts to ensure the accuracy of the data, Vishay and Company do not guarantee that the data will be error-free. Vishay and Company do not make any representations, warranties, or guarantees that the data is completely accurate or up-to-date. In some cases, the data may have been simplified to remove proprietary detail while maintaining critical interface geometric detail for use by customers. Vishay and Company expressly disclaim all implied warranties regarding the data, including but not limited to any implied warranties or merchantability or fitness for a particular purpose. None of the foregoing parties shall be liable for any claims or losses of any nature, including, but not limited to, lost profits, punitive or consequential damages related to the data.

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Showing 1 to 12 of 12 entries
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