Custom Substrates - Conductor Pattern


Precision conductor patterns
Metalization on 1 or 2 surfaces
Various substrate materials


Vishay EFI custom specialty films / conductor patterned substrates are used in the hybrid circuit and microwave industries. These conductor patterns are precisely manufactured to be used for complex fan-outs, interconnects, high temperature, and RF / microwave designs. Vishay EFI custom specialty films / conductor patterned substrates can also be used in a wider variety of applications including jumpers, mounting pads, and bonding pads. The custom specialty film / conductor patterned substrates are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The custom specialty film / conductor patterned substrates are visually inspected to MIL-STD-883, method 2032 class H or K.
Vishay EFI offers the option of a sputter deposition of gold-tin solder with wt % of 80 / 20 while maintaining tolerances tighter than ± 2 % wt and control of film thickness to ± 1.0 µm. This capability allows deposition of customer AuSn patterns that can be used to fine-tune assembly processes to meet the most demanding requirements; the tight composition tolerance eliminates the need to adjust reflow process parameters to compensate for variations in solder composition. The gold-tin deposition process allows films with thickness ranging between 4.5 µm and 7 µm with a tolerance of ± 1.0 µm. Common applications for AuSn deposition are laser diode sub-mounts, fiber optic pump lasers, optical transmitters, optical receivers, optical transceivers and optical TOSA / ROSA packages. For further detail, please reference document: AuSn design guideline (www.vishay.com/doc?49248).
When designing hybrid assemblies to operate at temperatures above 125 °C it becomes important to provide monometallic interconnects to prevent intermetallic diffusion and resultant long term reliability problems. For these situations, Vishay Electro-Films (EFI) has developed processes for depositing both aluminum and gold bonding pads on the same


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