INT PRODUCT INFORMATION

Custom Substrates - Metal Via / Multilayer / Lumped Element
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pdf-icon-small Datasheet

FEATURES

Plated or filled via technology
Mulitlayer and overcoat patterning
Lumped element custom substrates

APPLICATIONS

Vishay EFI custom interconnect substrates are used in military, aerospace, hybrid circuit, telecommunications, microwave, and industrial applications. These custom interconnect substrates are manufactured to be used in heat transfer connectors, top to bottom connectors, and RF / microwave designs. Surface connections can be made by plated thru-holes, edge wraps, or filled via technologies. Custom cutouts of various sizes and shapes can also be created and used to fit into almost any size and shape. The custom interconnect substrates are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The custom interconnect substrates are 100 % electrically tested (when applicable) and visually inspected to MIL-STD-883, method 2032 class H or K.


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Showing 1 to 8 of 8 entries
Document TypeTitleDescriptionShare
Custom Design
STF - Combining Technology and Expertise of Applied Thin-Film, Electro-Films and UltraSource
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Datasheet
Custom Substrates - Metal Via / Multilayer / Lumped Element
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General Information
Vishay Electro-Films Testing Capabilities
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Product Literature
ElectroFAST - Prototype Delivery - EFI
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Support Tools
Custom Substrates- Build to Print Ceramic Solutions
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Support Tools
Custom Thin Film Substrates
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Support Tools
Custom Substrates - Cost Reduction Strategies for Thin Film Substrates
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Technical Notes
Applications and Design Guidelines of Plated and Filled Via Circuits
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