INT PRODUCT INFORMATION

Custom Substrates - Metal Via / Multilayer / Lumped Element
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FEATURES

Plated or filled via technology
Mulitlayer and overcoat patterning
Lumped element custom substrates

APPLICATIONS

Vishay EFI custom interconnect substrates are used in military, aerospace, hybrid circuit, telecommunications, microwave, and industrial applications. These custom interconnect substrates are manufactured to be used in heat transfer connectors, top to bottom connectors, and RF / microwave designs. Surface connections can be made by plated thru-holes, edge wraps, or filled via technologies. Custom cutouts of various sizes and shapes can also be created and used to fit into almost any size and shape. The custom interconnect substrates are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The custom interconnect substrates are 100 % electrically tested (when applicable) and visually inspected to MIL-STD-883, method 2032 class H or K.


Disclaimer:

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This data is being provided to you free of charge for your use but remains the sole property of Vishay Intertechnology, Inc. (''Vishay') or Ultra Librarian/EMA Design Automation®, Inc. (collectively, "Company"). This data is being provided as a convenience and for informational purposes only. Inclusion of links to this data on the Vishay website does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of Company. While Vishay and Company have used reasonable efforts to ensure the accuracy of the data, Vishay and Company do not guarantee that the data will be error-free. Vishay and Company do not make any representations, warranties, or guarantees that the data is completely accurate or up-to-date. In some cases, the data may have been simplified to remove proprietary detail while maintaining critical interface geometric detail for use by customers. Vishay and Company expressly disclaim all implied warranties regarding the data, including but not limited to any implied warranties or merchantability or fitness for a particular purpose. None of the foregoing parties shall be liable for any claims or losses of any nature, including, but not limited to, lost profits, punitive or consequential damages related to the data.

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