Custom Substrates - Metal Via / Multilayer / Lumped Element


Plated or filled via technology
Mulitlayer and overcoat patterning
Lumped element custom substrates


Vishay EFI custom interconnect substrates are used in military, aerospace, hybrid circuit, telecommunications, microwave, and industrial applications. These custom interconnect substrates are manufactured to be used in heat transfer connectors, top to bottom connectors, and RF / microwave designs. Surface connections can be made by plated thru-holes, edge wraps, or filled via technologies. Custom cutouts of various sizes and shapes can also be created and used to fit into almost any size and shape. The custom interconnect substrates are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The custom interconnect substrates are 100 % electrically tested (when applicable) and visually inspected to MIL-STD-883, method 2032 class H or K.


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