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PowerPAK® 10 x 12

The PowerPAK® 10 x 12 is a low-profile TO-leadless surface-mount package (9.9 mm × 11.7 mm × 2.3 mm) delivering the best thermal capability among SMD packages. An integrated Kelvin source connection helps minimize parasitics for cleaner, faster switching. The robust footprint supports high current handling and power density, enabling compact, board-friendly layouts for telecom, server, and inverter designs that demand efficient thermal performance.

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MOSFETs - PowerPAK® 10 x 12

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PowerPAK® 10 x 12 + Gen 4 600 V Superjunction MOSFETs With Fast Body Diode

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PowerPAK® 10 x 12 + Gen 4 600 V Superjunction MOSFETs

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