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PowerPAK® 1212-F

The PowerPAK® 1212-F is a flip-chip style, 3.3 mm × 3.3 mm MOSFET package optimized for thermal and layout efficiency. A maximized source pad (≈4.13 mm² vs 0.36 mm² in the 1212-8S) dramatically improves heat spreading, yielding low RθJA (≈18 °C/W). The central-gate geometry reduces parasitics and simplifies paralleling on single-layer PCBs, enabling cooler operation at equal power and higher power density than prior 1212-8 variants. 

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Infographic

SiSD5300DN 30 V MOSFET in PowerPAK® 1212-F

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Run Electronics Cooler With MOSFETs in the PowerPAK® 1212-F

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