PowerPAIR® 3.3FSWL

The PowerPAIR® 3 × 3FSWL is a symmetric dual MOSFET package that integrates high side and low side devices in a single 3.3 mm × 3.3 mm footprint, cutting component counts and shortening current loops. Its flip-chip construction improves thermal dissipation and lowers parasitics, supporting cleaner, higher frequency switching. The topology is optimized for ~50 % duty-cycle operation, streamlining compact, efficient buck, buck-boost, and half-bridge layouts.