PowerPAK® 8 x 8L

The PowerPAK® 8 x 8L is a gullwing, lowprofile power MOSFET package engineered for industrial use. It pairs ultra low thermal impedance (to ~0.45 °C/W) with high current capability and robust UIS performance. Versus the D2PAK it saves ~60 % board area and ~57 % thickness, and it outclasses the TOLL in size and thermal behavior, while maintaining reliable solder joints for compact, thermally efficient hot-swap, motor control, and power stages.